Samsung Electronics (Samsung) announced at its Foundry Forum 2022 earlier today that it is committed towards bringing its more advanced chip process technology, the 1.4nm process to be exact, to life, and that plans for it are already in the pipeline. As for when we can expect the new process node, the Korean electronics giant says that it expects the new chip to enter mass production by 2027.
“The technology development goal down to 1.4nm and foundry platforms specialized for each application, together with stable supply through consistent investment are all part of Samsung’s strategies to secure customers’ trust and support their success,” Dr Si-young Choi, president and head of Foundry Business at Samsung Electronics, said at the forum. “Realizing every customer’s innovations with our partners has been at the core of our foundry service.”
The 1.4nm comes after Samsung having successfully entered its 3nm process into mass production. On that note and like its bigger counterpart, the brand also announced that the new chip will be made using an enhanced version of its Gate-All-Around (GAA) technology. In the meantime, to fill in the gap in between, Samsung also announced that it will be introducing another 2nm process, which will enter mass production by the year 2025. Additionally, it also announced that a new 3D Packaging X-Cube with micro-bump interconnection will also be ready for mass production in 2024, while a bump-less X-Cube will follow in 2026.
Some of you are probably wondering: what exactly will Samsung be using its 1.4nm process for, once it becomes more widely available in 2027. Well, besides the possibility of seeing the chip in mobile devices, it’s clear that Samsung will want to see its products being used in the realm of high-performance computing (HPC), AI, the expansion of 5G and 6G connectivity, or even be applied in automotive scenarios.
(Source: Samsung)
The post Samsung Announces Plans For 1.4nm Process By 2027 appeared first on Lowyat.NET.
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